Purification & CVD
We manufacture high-quality semiconductor components using process conditions that precisely control defects, uniformity, and composition.
Precision Ceramic Machining
We achieve customized geometries and surface finishes through standardized combinations of machining processes while minimizing machining damage and residual stress.
Cleaning
We standardize cleaning recipes and process conditions to reduce residual particles and contamination.
We deliver integrated solutions for essential semiconductor materials, spanning from high-purity graphite to advanced CVD materials.
Through the precise control of thickness, defect levels, uniformity, and composition, we manufacture ultra-high-purity, high-density components optimized for semiconductor equipment.
- SiC(㎜-, ㎛-scale)
- TaC(㎛-scale)
- PyC(㎛-scale)
We provide high-precision ceramic machining solutions by integrating standardized processes to meet customer-specific requirements for complex geometries and critical surface characteristics, including roughness and flatness.
- SiC
- Graphite
- Etc.
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CVD Material MachiningInitial ShapingBasic machining and removal of residual graphiteRotary GrindingControl of thickness uniformity and flatnessPrecision Profile & Step MachiningIntegrated 3D machining utilizing MCT (Machining Center)Ultra-Precision Surface Finishing (CMP)Minimization of surface damage and realization of customized surface roughness
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Graphite Machining
Ultra-precision substrate machining for the manufacturing of core components for semiconductor equipment and functional deposition.
TurningHigh-precision machining of cylindrical and ring shapes, as well as inner and outer diametersMillingPrecision machining of complex geometries, steps, and fastener holes
A standardized high-purity cleaning solution designed to completely remove fine particles and organic contaminants generated during processing and machining, ensuring optimal product yield and quality.
